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Lebanon Microelectronics packages

Leading supplier of microelectronic packages in China,offer many open tool packages for the applications that require protection from various environmental conditions.Also refer to hybrid packages, multi-chip module housings, or IC packages.

Product Description

Product details

Material
-Copper,Copper Alloy,Brass -Nickel Silver,Nickel Alloy -Kovar,Invar
-SPCC/CRS,Stainless Steel -Mu Metal,Permalloy -Aluminum,Aluminum Alloy
-Others    

 

Coating
-Electroless and electrolytic Nickel -Gold,Sliver -Tin/Lead 60/40,Pure Tin,Zinc
-Polishing,Sandblasting -Spraying,Coloring and so on  

 

Specifications
-Machined box packages -Stamping case,Deep drawn housing -Heat treatment
-Glass to metal sealing -Welding -Sliver brazing,etc.

Contact Us

Phone: +86-15128720000
Tel: +86-317-8250000
E-mail: honey@hi-techelectronic.com
Add: Hougaoyao Industrial Zone, Botou, Cangzhou City, Hebei Province, China

Our Products

We are the professional manufacturer of hermetic packages, as well as electronic component housings, glass to metal seal, precision stamping parts and hybrid packaging solutions etc... 

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